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Technologies & Business
3Di (3D interconnects) : Fine Patterning
3Di technology is largely used for display, MEMS, and precision parts.
We have the technology to implement via filling, which is necessary for tall pillar, TSV, etc., in a non-plating method in micro-level fine patterns and semiconductor 3D packaging process.
3Di 기술은 크게 Display와 MEMS, 정밀부품의 마이크로급 정밀배선과, 반도체 3D packaging공정에서 Tall Pillar, TSV 등에 필요한 Via Filling을 비도금 방식으로 구현하는 interconnects 기술을 보유하고 있습니다.