Technologies & Business기술 및 사업
AMAP+ : Advanced Materials & Products +++
![Technologies & Business 기술 및 사업 이미지](/images/kor06r-18-0410/sub/img_sub2_1_1.jpg)
- 3Di(3D interconnects) : Fine patterning
- Fine pattern width 10~100um with 3D motion.
Application : Display panel(backplane), MEMS, Automotive, etc.
![3Di(3D interconnects) : Fine patterning 이미지](/images/kor06r-18-0410/sub/img_sub2_1_2.jpg)
- 3Di(3D interconnects) : NPP(Non-Plating Pillar) System & Materials
- Tall pillar filling by non-plating method.
Application : Pan-out package.
![3Di(3D interconnects) : NPP(Non-Plating Pillar) System & Materials 이미지](/images/kor06r-18-0410/sub/img_sub2_1_3.jpg)
- uAG(Ultra-Anti-Glare) Glass
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Nano level anti-glare glass(manufacturing) : Gloss 140~190.
Functional options
- High refraction, optic filters, white-sim free, etc.
- 3D glass forming.
Application : Display cover glass(smartphone, TV, cockpit, etc.), optic filters, etc.
![uAG(Ultra-Anti-Glare) Glass 이미지](/images/kor06r-18-0410/sub/img_sub2_1_4.jpg)
- Advanced Materials
- Advanced amterials for 3Di, uAG & optic coating.
![Advanced Materials 이미지](/images/kor06r-18-0410/sub/img_sub2_1_5.jpg)
- Process & system development
- Process development for display & semiconductor application.
Manufacturing line design and process tools development.
![Process & system development 이미지](/images/kor06r-18-0410/sub/img_sub2_1_6.jpg)