AMAP PLUS is a company expanding its business with major technologies such as optical surface treatment and 3D interconnects (3Di) on various substrates such as wafer, plastic, ceramic, including glass in semiconductor and display.
In particular, nano-grade Ultra-Anti-Glare surface treatment (uAG) has the world best processing technology of about 140-190 gloss level, and continuing research work to expand to high-end applications with various functional coatings.
In the case of 3Di, it’s available to perform a fine pattern with a line width of 10 to 100 microns that can be applied to display and MEMS application. In particular, the trench pattern (embedded wiring) is valuable in various high-end fields such as LED and bezel-less display.
In addition, various researches are continuing to apply 3Di technology that implements the tall pillar in the semiconductor package field or the Cu fill process in the TSV by the non-plating method.
AMAP PLUS has professional manpower with various experiences in the process and materials of semiconductor and display, and is constantly try to deliver our value accumulated in the global market.
We look forward to your support.
